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JSP11C Rackmount/Wallmount CPCI Chassis
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Dimensions according to IEEE 1101.10/.11
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Advanced EMC shielding without gaskets, standard Rapid Assembly |
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Easy access for maintenance |
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Sheet steel, pre galvanized enclosure |
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Fully compliant 160mm and 80mm card guides with keying and clip |
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Aluminum profiles, modules and panels |
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Vibration resistant |
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Designed to meet UL, CE and FCC requirements |
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The JSP11C family of enclosures provide a high quality, cost effective platform for packaging rack mount Compact PCI (2.0, 2.16, 2.17, 2.20) applications. Designed to IEEE 1101.10/.11 standards, JSP11C enclosures give advanced EMC shielding protection and are available with a wide range of options. Based on a modular packaging approach, the system can be configured by selecting the backplane, PSU, device modules and the number of slots. Engineered for superior cooling the JSP11C is available with either front to rear or bottom to top airflow. Standard heights are 3U-9U with custom sizes possible. The JSP11C will accept 3U or 6U cards mounted vertically or horizontally.
Systems can be configured with or without rear I/O card cage.
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Technical Features
- Dimensions according to IEEE 1101.10/.11
- 160mm/80mm card guides with keying and ESD clip
- Advanced EMC shielding without gaskets, standard
- Rapid assembly
- Easy access for maintenance
- Sheet steel, pre galvanized enclosure
- Aluminum extrusions, modules and panels
- Vibration resistant
- Designed to meet UL, CE, FCC and NEBS requirements
Configuration Options
- Compatible with PICMG: 2.0, 2.16, 2.17, 2.20
- H.110 Optional
- Mounting for 3U or 6U cPCI cards
- Vertical or horizontal card mounting
- Available heights 3U to 9U
- Rear I/O
- Standard 4, 6 and 8 slot backplanes
- Wide range of EMC shield peripheral modules
- Wide range of PSU options: fix mount, plug in, N+1
- 90-240VAC or 48VDC input
- Shelf Management: PICMG 2.9, IPMI
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Our Locations |
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CompactPCI - CPCI
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| Our 25X and 25+ models come with an extreme cooling package which is designed to increase airflow allowing the server to run at lower temperatures. This exclusive design can cool a server by as much as 60 degrees F in a 75 degree ambient. Heat Kills, especially in temperature-sensitve communications cards. Keep your cards cool with the 25X and 25+ series servers. |
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Increased density of cards = lower Total Cost of Ownership |
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Lower temperature = less card failures |
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Less downtime = more productivity |
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© 2008 Just Servers, Inc.
Division of Polaraco, Inc. |
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JustServers.com
Division of Polaraco, Inc.
Wharton, NJ 07885
Tele: 973-989-5565 FAX: 973-366-9815 |
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| Custom servers, rackmount chassis, ISA passive backplane, Windows 2000, Dialogic Integration, PBX, IP PBX, Trixbox, Digium cards, CPCI, Compact PCI |
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